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Searched in jobs for keywords fabrication and engineer

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Mechanical Design Engineer: posted on 06/07/2004
location England Hampshire
description We are looking for a Mechanical Design Engineer with 1-4 years experience who is looking for their next career move to work on the design of equipment assembly and housing design for handheld military equipment used in rugged and Defence environments. Work will be done in both 2D and 3D CAD packages (AutoCAD & Inventor) for applications such as machined and cast housing design, sheet metal design, environmental seals, battery holders & interconnecting cable design. It would be beneficial if yo
skills mechanical defence or military autocad or inventor sheetmetal or fabrication
CVD Equipment Engineer: posted on 02/07/2004
location UK Eire, Ireland, UK, Scotland, North West, North Eas
description Working on 200m (8”) wafer technology utilising Applied Materials CVD Thin Film tool - AMAT 5000 you will be undertaking Maximising Uptime, Preventative Maintenance, Equipment Qualification, Installation including chemical handling, Fault Finding, Excursion Prevention and Equipment Improvement. BSc in Electronics with experience in a 150mm+ (6”) High Volume Wafer Fabrication / Semiconductor Manufacturing environment using CVD Thin Film tools such as AMAT 5000. More vacancies at www.remjobs.co.uk
skills Skills List: CVD Equipment Engineer Semiconductor Manufacturer, Thin Film, CVD, Equipment Engineer, 200mm wafer 8” wafer, Applied Materials, AMAT 5000, Maximising Uptime, Preventative Maintenance, Equipment Qualification, Hook-Up, Installation, che
CVD Equipment Engineer: posted on 02/07/2004
location UK Eire, Ireland, UK, Scotland, North West, North Eas
description Working on 200m (8”) wafer technology utilising Applied Materials CVD Thin Film tool - AMAT 5000 you will be undertaking Maximising Uptime, Preventative Maintenance, Equipment Qualification, Installation including chemical handling, Fault Finding, Excursion Prevention and Equipment Improvement. BSc in Electronics with experience in a 150mm+ (6”) High Volume Wafer Fabrication / Semiconductor Manufacturing environment using CVD Thin Film tools such as AMAT 5000. More vacancies at www.remjobs.co.uk
skills Skills List: CVD Equipment Engineer Semiconductor Manufacturer, Thin Film, CVD, Equipment Engineer, 200mm wafer 8” wafer, Applied Materials, AMAT 5000, Maximising Uptime, Preventative Maintenance, Equipment Qualification, Hook-Up, Installation, che
CVD Equipment Engineer: posted on 02/07/2004
location UK Eire, Ireland, UK, Scotland, North West, North Eas
description Working on 200m (8”) wafer technology utilising Applied Materials CVD Thin Film tool - AMAT 5000 you will be undertaking Maximising Uptime, Preventative Maintenance, Equipment Qualification, Installation including chemical handling, Fault Finding, Excursion Prevention and Equipment Improvement. BSc in Electronics with experience in a 150mm+ (6”) High Volume Wafer Fabrication / Semiconductor Manufacturing environment using CVD Thin Film tools such as AMAT 5000. More vacancies at www.remjobs.co.uk
skills Skills List: CVD Equipment Engineer Semiconductor Manufacturer, Thin Film, CVD, Equipment Engineer, 200mm wafer 8” wafer, Applied Materials, AMAT 5000, Maximising Uptime, Preventative Maintenance, Equipment Qualification, Hook-Up, Installation, che
CVD Equipment Engineer: posted on 02/07/2004
location UK Eire, Ireland, UK, Scotland, North West, North Eas
description Working on 200m (8”) wafer technology utilising Applied Materials CVD Thin Film tool - AMAT 5000 you will be undertaking Maximising Uptime, Preventative Maintenance, Equipment Qualification, Installation including chemical handling, Fault Finding, Excursion Prevention and Equipment Improvement. BSc in Electronics with experience in a 150mm+ (6”) High Volume Wafer Fabrication / Semiconductor Manufacturing environment using CVD Thin Film tools such as AMAT 5000. More vacancies at www.remjobs.co.uk
skills Skills List: CVD Equipment Engineer Semiconductor Manufacturer, Thin Film, CVD, Equipment Engineer, 200mm wafer 8” wafer, Applied Materials, AMAT 5000, Maximising Uptime, Preventative Maintenance, Equipment Qualification, Hook-Up, Installation, che
Thin Film Process Engineer: posted on 02/07/2004
location UK Eire, Ireland, UK, Scotland, North West, North Eas
description Working on 200m (8”) wafers using Applied Materials ( AMAT ) Thin Film High Density Plasma tools and High Vacuum equipment you will be doing Process Improvement and Sustaining Engineering including Yield Improvement, Defect Reduction, Excursion Prevention and SPC, FMEA, DOE methods. BSc in Physics or Materials with experience in Thin Film High Density Plasma processing in a 150mm+ (6”) High Volume Wafer Fabrication / Semiconductor Manufacturing environment. More vacancies at www.remjobs.co.uk
skills Thin Film Process Engineer Thin Film High Density Plasma Process Engineer, 200m wafer, 8” wafer, Applied Materials, AMAT, Thin Film High Density Plasma tools, High Vacuum equipment, Process Improvement, Sustaining Engineering, Semiconductor Manufact
Thin Film Process Engineer: posted on 02/07/2004
location UK Eire, Ireland, UK, Scotland, North West, North Eas
description Working on 200m (8”) wafers using Applied Materials ( AMAT ) Thin Film High Density Plasma tools and High Vacuum equipment you will be doing Process Improvement and Sustaining Engineering including Yield Improvement, Defect Reduction, Excursion Prevention and SPC, FMEA, DOE methods. BSc in Physics or Materials with experience in Thin Film High Density Plasma processing in a 150mm+ (6”) High Volume Wafer Fabrication / Semiconductor Manufacturing environment. More vacancies at www.remjobs.co.uk
skills Thin Film Process Engineer Thin Film High Density Plasma Process Engineer, 200m wafer, 8” wafer, Applied Materials, AMAT, Thin Film High Density Plasma tools, High Vacuum equipment, Process Improvement, Sustaining Engineering, Semiconductor Manufact
Ion Implantation Process Engineer: posted on 02/07/2004
location UK Eire, Ireland, UK, Northern Ireland, Scotland, Nor
description Working on 200mm (8”) Wafers utilising Applied Materials Ion Implant tools ( AMAT ) Process Improvement and Sustaining Engineering for Semiconductor Manufacture. This will include Yield Improvement, Defect Reduction and Process Improvement methods such as SPC, FMEA, DOE and associated Data Analysis. BSc in Physics / Materials Science with experience in Ion Implantation in a 150mm+ (6”) High Volume Wafer Fabrication / Semiconductor Manufacturing environment. More vacancies at www.remjobs.co.uk
skills Ion Implantation Process Semiconductor Manufacturer, Ion Implantation Process Engineer, 200m wafer, 8” wafer, Applied Materials, Ion Implant, AMAT, High Vacuum, Process Improvement, Sustaining Engineering, Semiconductor Manufacture, Yield Improvem
Ion Implantation Process Engineer: posted on 02/07/2004
location UK Eire, Ireland, UK, Scotland, North West, North Eas
description Working on 200mm (8”) Wafers utilising Applied Materials Ion Implant tools ( AMAT ) Process Improvement and Sustaining Engineering for Semiconductor Manufacture. This will include Yield Improvement, Defect Reduction and Process Improvement methods such as SPC, FMEA, DOE and associated Data Analysis. BSc in Physics / Materials Science with experience in Ion Implantation in a 150mm+ (6”) High Volume Wafer Fabrication / Semiconductor Manufacturing environment. More vacancies at www.remjobs.co.uk
skills Ion Implantation Process Semiconductor Manufacturer, Ion Implantation Process Engineer, 200m wafer, 8” wafer, Applied Materials, Ion Implant, AMAT, High Vacuum, Process Improvement, Sustaining Engineering, Semiconductor Manufacture, Yield Improvem
Photolithography Process Engineer: posted on 02/07/2004
location UK Eire, Ireland, UK, Scotland, North West, North Eas
description Working on 300mm (12”) technology utilising ASML Photolithography Equipment – Stepper, Tracks and Coaters, you will undertake Process Improvement for Semiconductor Manufacture include Layer Qualification, Die Yield, Line Yield Enhancement, Rework Reduction, Cpk Improvements and Data Analysis for SPC, DOE methods etc…BSc in Physics with experience in Photolithography in a 150mm+ (6”) Wafer Fabrication /Semiconductor Manufacturing environment. More vacancies at www.remjobs.co.uk
skills Photolithography Process Engineer Semiconductor Manufacturer, Photolithography Process Engineer, 300mm, 12”, Wafer technology, ASML Photolithography Equipment, Stepper, Tracks, Coaters, ASML Stepper, ASML Tracks, ASML Coaters, Process Improvement,
Photolithography Process Engineer: posted on 02/07/2004
location UK Eire, Ireland, UK, Scotland, North West, North Eas
description Working on 300mm (12”) technology utilising ASML Photolithography Equipment – Stepper, Tracks and Coaters, you will undertake Process Improvement for Semiconductor Manufacture include Layer Qualification, Die Yield, Line Yield Enhancement, Rework Reduction, Cpk Improvements and Data Analysis for SPC, DOE methods etc…BSc in Physics with experience in Photolithography in a 150mm+ (6”) Wafer Fabrication /Semiconductor Manufacturing environment. More vacancies at www.remjobs.co.uk
skills Photolithography Process Engineer Semiconductor Manufacturer, Photolithography Process Engineer, 300mm, 12”, Wafer technology, ASML Photolithography Equipment, Stepper, Tracks, Coaters, ASML Stepper, ASML Tracks, ASML Coaters, Process Improvement,
Senior Engineer - (Optical Fab/Yield Improvement): posted on 20/04/2004
location Scotland Central Scotland
description Location: Central Scotland Salary: to £35000 Qualification: First Degree (BA/BS/BSc/BEng/BSEE) Experience: 5 years My client produces high performance optical crystals for medical imaging. As they continue to expand, an opportunity has emerged for an experienced Fabrication Engineering Manager with expertise in optical / mechanical fabrication process and equipment (e.G. Lapping, polishing, slicing, dicing). · You will be responsible for developing and validating the processes and technology necessary to optically fabricate the oxide crystals they manufacture. · You will supervise process transfer, quality and yields at their volume sub-contractors. · You will continuously improve the fabrication processes and technology, in terms of manufacturing cost, product yields, capital equipment utilisation and overall fabrication efficiency, including automation of fabrication processes · You may be expected to project manage the development and build of an in-house optical fabrication/process facility Broad awareness of fabrication equipment and technology options is essential. You will demonstrate strong organisational and leadership abilities coupled with excellent communication and team building skills. Position may involve global travel. To apply for this position please contact Andrew Grier on 01698 527120 or AGrier@Redlineplc.com For further details on this and many other vacancies visit our website at http://www.redlineplc.com
skills
Fibre Optics Experimental R&D: posted on 19/03/2004
location Devon
description South West £25k-£40k plus excellent benefits My client are looking for an outstanding experimental scientist or engineer to lead the planning and execution of a variety of experimentally focused R&D projects, in areas including fibre optics, material sciences, and fibre fabrication and characterization. You will be comfortable carrying out all aspects of practical laboratory work and be confident translating your findings into clearly communicated, actionable recommendations. You should be a strong, mentally agile and versatile technical problem solver and be self-directed with the motivation and capability to take on project management responsibilities. A strong practical and theoretical background in fibre-optics or general guided-wave optics research, ideally at post-doc level, is highly desirable, but candidates with a background in other relevant areas - including for example semiconductors, glasses or conventional optics - will be considered. As a member of a world-leading team in an exciting new technology you will have significant learning and career development opportunities. Compensation will be commensurate with experience and will include a full benefits package and share options To apply for this position please contact Andy Grant on 01582 450054 or AGrant@Redlineplc.com. For further details on this and many other vacancies visit our website at http://www.redlineplc.com
skills
Fibre Optics Experimental R&D: posted on 03/03/2004
location Devon
description South West £25k-£40k plus excellent benefits My client are looking for an outstanding experimental scientist or engineer to lead the planning and execution of a variety of experimentally focused R&D projects, in areas including fibre optics, material sciences, and fibre fabrication and characterization. You will be comfortable carrying out all aspects of practical laboratory work and be confident translating your findings into clearly communicated, actionable recommendations. You should be a strong, mentally agile and versatile technical problem solver and be self-directed with the motivation and capability to take on project management responsibilities. A strong practical and theoretical background in fibre-optics or general guided-wave optics research, ideally at post-doc level, is highly desirable, but candidates with a background in other relevant areas - including for example semiconductors, glasses or conventional optics - will be considered. As a member of a world-leading team in an exciting new technology you will have significant learning and career development opportunities. Compensation will be commensurate with experience and will include a full benefits package and share options To apply for this position please contact Andy Grant on 01582 450054 or AGrant@Redlineplc.com. For further details on this and many other vacancies visit our website at http://www.redlineplc.com
skills
Field Applications Engineer - Europe: posted on 23/02/2004
location Scotland Scotland
description Our US based client provides innovative solutions in the design and manufacture of analog power ICs serving high-growth applications worldwide within the Automotive Electronics, Office Automation, Industrial and Portable Electronics markets. A new position has been created for an experienced electronic engineer to join the expanding technical support team. The Field Applications will support Power Integrated Circuit sales in Europe, for both existing products and defining new product opportunities. Duties of the Field Applications Engineer include:- Promotion and presentation of technology and products to customers. Education of customers on products and features to secure design wins Establishing strong working relationships with customers to assist in the sale/design/development process Understanding commercial aspect of the development process Communicating market trends and competitive information Understanding customer issues and influence technical/engineering decisions, including future product development decisions Ideal candidates will be educated to honours degree or equivalent standard and would have 5 years of experience with power integrated circuit applications in automotive and industrial systems. They would also benefit from some knowledge of German or French language and some knowledge of IC design, fabrication and quality systems. This position requires both applications engineering and sales expertise. This is not a position requiring extensive laboratory time and the candidate will be expected to travel approximately 50% of time in and around mainland Europe. Building solid technical relationships with customers is instrumental to the success of this position.
skills
Field Applications Engineer - Europe: posted on 23/02/2004
location Scotland Scotland
description Our US based client provides innovative solutions in the design and manufacture of analog power ICs serving high-growth applications worldwide within the Automotive Electronics, Office Automation, Industrial and Portable Electronics markets. A new position has been created for an experienced electronic engineer to join the expanding technical support team. The Field Applications will support Power Integrated Circuit sales in Europe, for both existing products and defining new product opportunities. Duties of the Field Applications Engineer include:- Promotion and presentation of technology and products to customers. Education of customers on products and features to secure design wins Establishing strong working relationships with customers to assist in the sale/design/development process Understanding commercial aspect of the development process Communicating market trends and competitive information Understanding customer issues and influence technical/engineering decisions, including future product development decisions Ideal candidates will be educated to honours degree or equivalent standard and would have 5 years of experience with power integrated circuit applications in automotive and industrial systems. They would also benefit from some knowledge of German or French language and some knowledge of IC design, fabrication and quality systems. This position requires both applications engineering and sales expertise. This is not a position requiring extensive laboratory time and the candidate will be expected to travel approximately 50% of time in and around mainland Europe. Building solid technical relationships with customers is instrumental to the success of this position.
skills
Software Sales Engineer: posted on 20/02/2004
location West Midlands (Birmingham) Midlands
description Software House dedicated to producing leading edge Management Information Systems (MIS) for the manufacturing sector seek a Software Sales Engineer. Responsibilities: identifying leads within the precision engineering & fabrication manufacturing markets, conducting presentations on the software & its capabilities, negotiating the sale of the software, installation and training. You will need a proven track record in the sales of software management information systems e.g. ERP, MRP, CRM etc.
skills MIS, Management Information Systems, Software Sales, ERP, MRP, CRM
Technical Sales Engineer - MRP: posted on 20/02/2004
location England Midlands
description Software House producing leading edge Management Information Systems for manufacturing sector seek a Software Sales Engineer. Responsible for identifying leads in the precision engineering & fabrication manufacturing markets around the Midlands, conducting presentations, negotiating the sale, through to the installation & training. You will need a proven track record in the sales of software management information systems e.g. ERP, MRP, CRM etc preferably from a mechanical/machinery background.
skills ERP, MRP, CRM etc preferably from a mechanical/machinery background
Mechanical Design Engineer: posted on 13/02/2004
location England Hampshire
description We are looking for a mechanical design engineer who has experience of 3D design using Unigraphics. The role will involve injection moulding design & steel fabrication design within the automotive industry. YOU MUST BE ABLE TO SUPPLY YOUR OWN MACHINE AND UNIGRAPHICS works station.
skills unigraphics mechanical design automotive
Optoelectronic Process/Cleanroom Engineer: posted on 12/02/2004
location Oxfordshire
description £20k-£30k Oxon Your role will be to carry out and develop standard device processing steps including evaporation, lithography etc. You will also be responsible for maintining cleanroom equipment such as mask aligners etc and running regular standard tests. You should have a first degree followed by several years experience, ideally in optoelectronic devices but possibly in silicon electronic devices or another semiconductor field. You must be able to develop processes as well as following them. Areas of interest include wet etch, fabrication, photolith, PECVD, RIE, ECR (electron cycolotron resonance), ICP, electron/thermal evaporation. Experience with materials such as gallium nitride (GaN) is especially interesting. The role will probably be on a 1 year contract initially with a possibility of conversion to permanent employment depending on circumstances. Please contact Andy Grant for further information. For further details on this and many other vacancies visit our website at http://www.redlineplc.com
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Technical Sales Engineer - MRP: posted on 10/02/2004
location England Midlands
description Software House producing leading edge Management Information Systems for manufacturing sector seek a Software Sales Engineer. Responsible for identifying leads in the precision engineering & fabrication manufacturing markets around the Midlands, conducting presentations, negotiating the sale, through to the installation & training. You will need a proven track record in the sales of software management information systems e.g. ERP, MRP, CRM etc preferably from a mechanical/machinery background.
skills ERP, MRP, CRM etc preferably from a mechanical/machinery background
Software Sales Engineer: posted on 10/02/2004
location West Midlands (Birmingham) Midlands
description Software House dedicated to producing leading edge Management Information Systems (MIS) for the manufacturing sector seek a Software Sales Engineer. Responsibilities: identifying leads within the precision engineering & fabrication manufacturing markets, conducting presentations on the software & its capabilities, negotiating the sale of the software, installation and training. You will need a proven track record in the sales of software management information systems e.g. ERP, MRP, CRM etc.
skills MIS, Management Information Systems, Software Sales, ERP, MRP, CRM
Technical Sales Engineer - MRP: posted on 04/02/2004
location England Midlands
description Software House producing leading edge Management Information Systems for manufacturing sector seek a Software Sales Engineer. Responsible for identifying leads in the precision engineering & fabrication manufacturing markets around the Midlands, conducting presentations, negotiating the sale, through to the installation & training. You will need a proven track record in the sales of software management information systems e.g. ERP, MRP, CRM etc preferably from a mechanical/machinery background.
skills ERP, MRP, CRM etc preferably from a mechanical/machinery background
Software Sales Engineer: posted on 04/02/2004
location West Midlands (Birmingham) Midlands
description Software House dedicated to producing leading edge Management Information Systems (MIS) for the manufacturing sector seek a Software Sales Engineer. Responsibilities: identifying leads within the precision engineering & fabrication manufacturing markets, conducting presentations on the software & its capabilities, negotiating the sale of the software, installation and training. You will need a proven track record in the sales of software management information systems e.g. ERP, MRP, CRM etc.
skills MIS, Management Information Systems, Software Sales, ERP, MRP, CRM
Semiconductor Device & Circuit Research Engineer: posted on 04/02/2004
location Oxfordshire
description C£28k-£38k Oxon In this role you will be responsible for the development of a next generation electronic light sensor concept. This will be a silicon-based optical sensor - you will have responsibility for realisation of the electronic control / interface, and the product integration pathway for the technology. You should be MSc or PhD qualified, combining a proven research background with a keen interest in practical device solutions. You must have experience in the development of semiconductor devices and ideally also analogue circuits. Experience of CMOS image sensors (or similar) would be advantageous, as would a background in IPR generation. The role will encompass areas such as sensor fabrication and the development of a reference board to simulate circuit behaviour. The successful candidate will be very bright, with the ability to explore a broad area with minimum supervision. Personality-wise, they will be a self starter and will be able to grow their responsibility. They should be R&D focused but with a keen interest in the practical application of technology. Please contact Andy Grant for further information. For further details on this and many other vacancies visit our website at http://www.redlineplc.com
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Senior IC Layout Engineer: posted on 28/01/2004
location Cambridgeshire East Anglia, Cambridge
description Our client seeks an experienced Physical /Layout design engineer for Full Custom CMOS layout of complex RF/Analogue mixed mode ASICs for wireless communications. You will aid and assist the Head of Physical Design in the layout, top level assembly and tape out of RF/Analogue mixed mode ASIC's in a number of Deep Sub Micron CMOS technologies. Main tasks will include:- 'Tape out' completed database and all the associated documentation and checks. Floor planning of complete chips/complex blocks. Generation of Outline Cell for digital Place and Route tools and Padring. Layout of complex/critical blocks and cells. Full verification of all of the above. Understand and set up new fabrication processes/design rules as they are adopted. Provide quick and accurate chip size estimates based on 'what if' criteria. Guide, advise and train members of the design team in best layout practice. Ideally you will have five plus year's experience (more preferably) of CMOS Deep Sub Micron (0.18um and 0.13um) Full Custom IC layout and verification. This will range from the layout of standard library cells, through RF/Analogue block level, to top level pad ring and final chip assembly, verification and tape out. Experience in the following tools is sought:- Full Custom Tools: Tanner - L-Edit, Avanti - Enterprise, Mentor Graphics - IC Station, Cadence Verification Tools: Calibre, Dracula, Diva, xCalibre, Star RC-XT You must also be able to demonstrate expertise of the use and interpretation of DRC, LVS and back annotated extraction results. In addition the candidate will have previous experience in configuring and developing CAD tools and process set up, have the ability to work independently, or part of a team or be able to lead a small group. Experience with C, C++, or Skill would be advantageous. Additional programming language skills (C, C++, Skill) to be considered an advantage. A competitive salary is on offer including share options, non-contributory pension, medical insurance & health insurance.
skills mixed-signal, analog IC Layout, Tanner - L-Edit, Avanti -Enterprise, Mentor Graphics - IC Station, Calibre, Dracula, Diva, xCalibre, Star RC-XT
Semiconductor Quality and Failure Analysis Engineer: posted on 28/01/2004
location Wiltshire South West, Wiltshire
description Our client is a busy, growing design and fabrication organization with an international presence. With a fab based in South West UK, they are now seeking a quality and failure analysis engineer. The successful candidate will be responsible for the development of 8D corrective action reports for both customer and assembly/test complaints. Main responsibilities will also include defect analysis of in-line material from manufacturing/R&D using state of the art equipment. Quality and failure analysis experience within the semiconductor environment is necessary, in addition to a scientific/engineering degree. Problem solving, product engineering and 8D problem solving are advantageous, as would specific MOSFET experience. Please contact us to discuss further.
skills Engineer, IC, MOSFET, quality, semiconductor manufacturing, failure analysis, 8D.
Semiconductor Integration Engineer: posted on 28/01/2004
location Wiltshire South West, Wiltshire
description Our client is a busy, growing design and fabrication organisation with an international presence. With a fab based in South West UK, they are now seeking an integration engineer. The successful candidate will be responsible for the development of advanced power MOSEFT products including yield improvement and inline data correlations for process mapping. Main responsibilities include: - New product transfer into high volume wafer fab manufacturing - Yield control and improvement on advanced power MOSFET products - Interface with assembly sites for yield improvement - Test vehicle development for process mapping Please contact us to discuss further.
skills Engineer, IC, MOSFET, integration, semiconductor manufacturing, yield enhancement, process.
Thin Films Equipment Engineer: posted on 28/01/2004
location Wiltshire South West, Wiltshire
description Our client is a busy, growing design and fabrication organisation with an international presence. With a fab based in South West UK, they are now seeking a thin films equipment engineer to be ultimately responsible for the smooth running of thin films equipment and for maximising uptime. The successful candidate will be qualified to degree level and have strong equipment engineering experience including significant experience in thin films. Additional skills should include experience with 8" semiconductor manufacturing at 0.35um or below. Familiarity with Novellus CVD, applied PVD & CVD and /or AST RTP are required. Please contact us to discuss further.
skills Thin films, Engineer, IC, Equipment, semiconductor manufacturing, maintenance
RF/IC Engineer: posted on 28/01/2004
location England Scotland, Midlands, North England, South East, Ire
description Working within a millimeter wave Integrated Circuit environment, the successful candidate will be working on the design and test of MMIC’s, the role will also involve the fabrication and tuning of module packaging for MMIC’s. Analogue IC candidates also considered.
skills Experience of RF on Chip testing of MMIC’s or RF testing of completed MMIC modules: Analogue IC candidates experience of BIPOLAR Technologies; RF, IC, MMIC, Bipolar
Senior IC Process/Package Engineer: posted on 26/01/2004
location Cambridgeshire East Anglia, Cambridgeshire
description Excellent pre-IPO opportunity. Our client has developed a power IC technology based on a breakthrough technology, with clear advantages over the nearest competition, and now seek a process / package engineer with specific MOS and bipolar device experience. The successful candidate will have a good understanding of the semiconductor process environment as well as packaging experience and working with external customers. Our client is a fabless IC company, therefore the successful candidate will work with the company's foundry partners on the manufacturing process. A key requirement will be to analyse devices / processes for performance, manufacturability and reliability optimisation. You must have good MOS / bipolar device experience, with a history of introducing new process modules in a fabrication environment. Knowledge of high voltage / power devices, as well as DRIE etch techniques, and a thorough knowledge of semiconductor packaging would be ideal. This is an excellent opportunity to become involved at the initial stages of a company with a great deal of promise. Please contact us to discuss.
skills MOS / bipolar / high voltage device and process semiconductor engineering. Process module implementation / device engineering of Power ICs, packaging
Software Sales Engineer: posted on 26/01/2004
location West Midlands (Birmingham) Midlands
description Software House dedicated to producing leading edge Management Information Systems (MIS) for the manufacturing sector seek a Software Sales Engineer. Responsibilities: identifying leads within the precision engineering & fabrication manufacturing markets, conducting presentations on the software & its capabilities, negotiating the sale of the software, installation and training. You will need a proven track record in the sales of software management information systems e.g. ERP, MRP, CRM etc.
skills MIS, Management Information Systems, Software Sales, ERP, MRP, CRM
Technical Sales Engineer - MRP: posted on 22/01/2004
location England Midlands
description Software House producing leading edge Management Information Systems for manufacturing sector seek a Software Sales Engineer. Responsible for identifying leads in the precision engineering & fabrication manufacturing markets around the Midlands, conducting presentations, negotiating the sale, through to the installation & training. You will need a proven track record in the sales of software management information systems e.g. ERP, MRP, CRM etc preferably from a mechanical/machinery background.
skills ERP, MRP, CRM etc preferably from a mechanical/machinery background
RF/IC Engineer: posted on 21/01/2004
location England Scotland, Midlands, North England, South East, Ire
description Working within a millimeter wave Integrated Circuit environment, the successful candidate will be working on the design and test of MMIC’s, the role will also involve the fabrication and tuning of module packaging for MMIC’s. Analogue IC candidates also considered.
skills Experience of RF on Chip testing of MMIC’s or RF testing of completed MMIC modules: Analogue IC candidates experience of BIPOLAR Technologies; RF, IC, MMIC, Bipolar
RF/IC Engineer: posted on 13/01/2004
location England Scotland, Midlands, North England, South East, Ire
description Working within a millimeter wave Integrated Circuit environment, the successful candidate will be working on the design and test of MMIC’s, the role will also involve the fabrication and tuning of module packaging for MMIC’s. Analogue IC candidates also considered.
skills Experience of RF on Chip testing of MMIC’s or RF testing of completed MMIC modules: Analogue IC candidates experience of BIPOLAR Technologies; RF, IC, MMIC, Bipolar
RF/IC Engineer: posted on 06/01/2004
location England Scotland, Midlands, North England, South East, Ire
description Working within a millimeter wave Integrated Circuit environment, the successful candidate will be working on the design and test of MMIC’s, the role will also involve the fabrication and tuning of module packaging for MMIC’s. Analogue IC candidates also considered.
skills Experience of RF on Chip testing of MMIC’s or RF testing of completed MMIC modules: Analogue IC candidates experience of BIPOLAR Technologies; RF, IC, MMIC, Bipolar
Mechanical Service Engineer: posted on 24/12/2003
location England Middlesex, Essex, London, Surrey
description Our established Essex based Security focused client is currently seeking a highly experienced hands on mechanical engineer from one of the following industry backgrounds; Lift Engineering, Steel Fabrication, Automated Gates, Plant Maintenance, Fabrication or Welding. You will be a qualified mechanical engineer and have automated gate installation or service experience or be willing to use your existing mechanical engineering skills to learn and train within the automated gate industry.
skills Lift, Engineering, Service, Installation, Commissioning, Mechanical, Automated, Gate, Barrier
RF/IC Engineer: posted on 18/12/2003
location England Scotland, Midlands, North England, South East, Ire
description Working within a millimeter wave Integrated Circuit environment, the successful candidate will be working on the design and test of MMIC’s, the role will also involve the fabrication and tuning of module packaging for MMIC’s. Analogue IC candidates also considered.
skills Experience of RF on Chip testing of MMIC’s or RF testing of completed MMIC modules: Analogue IC candidates experience of BIPOLAR Technologies; RF, IC, MMIC, Bipolar
RF/IC Engineer: posted on 09/12/2003
location England Scotland, Midlands, North England, South East, Ire
description Working within a millimeter wave Integrated Circuit environment, the successful candidate will be working on the design and test of MMIC’s, the role will also involve the fabrication and tuning of module packaging for MMIC’s. Analogue IC candidates also considered.
skills Experience of RF on Chip testing of MMIC’s or RF testing of completed MMIC modules: Analogue IC candidates experience of BIPOLAR Technologies; RF, IC, MMIC, Bipolar
Software Sales Engineer: posted on 28/11/2003
location West Midlands (Birmingham) Midlands
description Software House dedicated to producing leading edge Management Information Systems (MIS) for the manufacturing sector seek a Software Sales Engineer. Responsibilities: identifying leads within the precision engineering & fabrication manufacturing markets, conducting presentations on the software & its capabilities, negotiating the sale of the software, installation and training. You will need a proven track record in the sales of software management information systems e.g. ERP, MRP, CRM etc.
skills MIS, Management Information Systems, Software Sales, ERP, MRP, CRM
RF/IC Engineer: posted on 27/11/2003
location England Scotland, Midlands, North England, South East, Ire
description Working within a millimeter wave Integrated Circuit environment, the successful candidate will be working on the design and test of MMIC’s, the role will also involve the fabrication and tuning of module packaging for MMIC’s. Analogue IC candidates also considered.
skills Experience of RF on Chip testing of MMIC’s or RF testing of completed MMIC modules: Analogue IC candidates experience of BIPOLAR Technologies; RF, IC, MMIC, Bipolar
RF/IC Engineer: posted on 18/11/2003
location England Scotland, Midlands, North England, South East, Ire
description Working within a millimeter wave Integrated Circuit environment, the successful candidate will be working on the design and test of MMIC’s, the role will also involve the fabrication and tuning of module packaging for MMIC’s. Analogue IC candidates also considered.
skills Experience of RF on Chip testing of MMIC’s or RF testing of completed MMIC modules: Analogue IC candidates experience of BIPOLAR Technologies; RF, IC, MMIC, Bipolar
Senior IC Process/Package Engineer: posted on 18/11/2003
location UK Cambridge, Cambs, United Kingdom
description Excellent pre-IPO opportunity. Our client has developed a power IC technology based on a breakthrough technology, with clear advantages over the nearest competition, and now seek a process / package engineer with specific MOS and bipolar device experience. The successful candidate will have a good understanding of the semiconductor process environment as well as packaging experience and working with external customers. Our client is a fabless IC company, therefore the successful candidate will work with the company's foundry partners on the manufacturing process. A key requirement will be to analyse devices / processes for performance, manufacturability and reliability optimisation. You must have good MOS / bipolar device experience, with a history of introducing new process modules in a fabrication environment. Knowledge of high voltage / power devices, as well as DRIE etch techniques, and a thorough knowledge of semiconductor packaging would be ideal. This is an excellent opportunity to become involved at the initial stages of a company with a great deal of promise. Please contact us to discuss. 
skills MOS / bipolar / high voltage device and process semiconductor engineering. Process module implementation / device engineering of Power ICs, packaging
Graduate Structural Engineer: posted on 14/11/2003
location Berkshire Reading, Berkshire
description Graduate Structural Engineer Reading, Berkshire Graduate Pack Formative role for keen graduate. International organisation needs to grow team from the bottom up. Areas include structural engineering, bridges, steel fabrication & construction, portal frames etc. Ideally looking for an applicable final year project and/or industrial year, don't be put off if you think this is the role for you. Contact me and tell me why I should consider you! *** Hundreds of jobs at www.remjobs.co.uk ***
skills Structural engineering, bridges, bridging, steel fabrication, steel construction, portal frames, steel structures.
Mechanical Service Engineer: posted on 13/11/2003
location England Middlesex, Essex, London, Surrey
description Our established Essex based Security focused client is currently seeking a highly experienced hands on mechanical engineer from one of the following industry backgrounds; Lift Engineering, Steel Fabrication, Automated Gates, Plant Maintenance, Fabrication or Welding. You will be a qualified mechanical engineer and have automated gate installation or service experience or be willing to use your existing mechanical engineering skills to learn and train within the automated gate industry.
skills Lift, Engineering, Service, Installation, Commissioning, Mechanical, Automated, Gate, Barrier
IC Process Engineers - Photolith: posted on 12/11/2003
location UK N/a, Eastern Europe, United Kingdom
description Our client is a leading international semiconductor organisation with a busy fab in Eastern Europe. Recent strong financial results mean that the company is optimistic about the market, and growing. They now seek a senior IC process engineer with strong photolithography experience (BiCMOS or BCD sub-micron technologies). Experience with Nikon equipment (G-7, G-8) is essential, as are good communication skills. This is a long term contract role, with good scope for being exposed to new technical challenges and new technologies. Good remuneration package is on offer. Please contact Neil Dickins to discuss in detail. 
skills Semiconductor, fabrication, IC, process, engineer, photolith, photolithography, lithography, contract, G-line steppers, Nikon
IC Process Engineers - Etch: posted on 12/11/2003
location UK N/a, Eastern Europe, United Kingdom
description Our client is a leading international semiconductor organisation with a busy fab in Eastern Europe. Recent strong financial results mean that the company is optimistic about the market, and growing. They now seek a senior IC process engineer with specific background in etch technologies (nitride, poly si, oxide, etc). Some exposure to LAM equipment is essential, as are good personal communication skills. This is a long term contract role, with good scope for being exposed to technical challenge and new technologies. Good remuneration package is on offer. Please contact Neil Dickins to discuss in detail. 
skills Semiconductor, fabrication, IC, process, engineer, etch, dry and wet processes, LAM, contract
IC Process Engineers - Etch: posted on 12/11/2003
location UK N/a, Eastern Europe, United Kingdom
description Our client is a leading international semiconductor organisation with a busy fab in Eastern Europe. Recent strong financial results mean that the company is optimistic about the market, and growing. They now seek a senior IC process engineer with specific background in etch technologies (nitride, poly si, oxide, etc). Some exposure to LAM equipment is essential, as are good personal communication skills. This is a long term contract role, with good scope for being exposed to technical challenge and new technologies. Good remuneration package is on offer. Please contact Neil Dickins to discuss in detail. 
skills Semiconductor, fabrication, IC, process, engineer, etch, dry and wet processes, LAM, contract
IC Process Engineers - Etch: posted on 12/11/2003
location UK N/a, Eastern Europe, United Kingdom
description Our client is a leading international semiconductor organisation with a busy fab in Eastern Europe. Recent strong financial results mean that the company is optimistic about the market, and growing. They now seek a senior IC process engineer with specific background in etch technologies (nitride, poly si, oxide, etc). Some exposure to LAM equipment is essential, as are good personal communication skills. This is a long term contract role, with good scope for being exposed to technical challenge and new technologies. Good remuneration package is on offer. Please contact Neil Dickins to discuss in detail. 
skills Semiconductor, fabrication, IC, process, engineer, etch, dry and wet processes, LAM, contract
IC Process Engineers - Etch: posted on 12/11/2003
location UK N/a, Eastern Europe, United Kingdom
description Our client is a leading international semiconductor organisation with a busy fab in Eastern Europe. Recent strong financial results mean that the company is optimistic about the market, and growing. They now seek a senior IC process engineer with specific background in etch technologies (nitride, poly si, oxide, etc). Some exposure to LAM equipment is essential, as are good personal communication skills. This is a long term contract role, with good scope for being exposed to technical challenge and new technologies. Good remuneration package is on offer. Please contact Neil Dickins to discuss in detail. 
skills Semiconductor, fabrication, IC, process, engineer, etch, dry and wet processes, LAM, contract
RF/IC Engineer: posted on 11/11/2003
location England Various positions throught the UK - Scotland, Midl
description Working within a millimeter wave Integrated Circuit environment, the successful candidate will be working on the design and test of MMIC’s, the role will also involve the fabrication and tuning of module packaging for MMIC’s. Analogue IC candidates also considered.
skills Experience of RF on Chip testing of MMIC’s or RF testing of completed MMIC modules: Analogue IC candidates experience of BIPOLAR Technologies; RF, IC, MMIC, Bipolar
RF/IC Engineer: posted on 04/11/2003
location England Various positions throught the UK - Scotland, Midl
description Working within a millimeter wave Integrated Circuit environment, the successful candidate will be working on the design and test of MMIC’s, the role will also involve the fabrication and tuning of module packaging for MMIC’s. Analogue IC candidates also considered.
skills Experience of RF on Chip testing of MMIC’s or RF testing of completed MMIC modules: Analogue IC candidates experience of BIPOLAR Technologies; RF, IC, MMIC, Bipolar
Thin Films Equipment Engineer: posted on 03/11/2003
location UK Not specified, South West , United Kingdom
description Our client is a busy, growing design and fabrication organisation with an international presence. With a fab based in South West UK, they are now seeking a thin films equipment engineer to be ultimately responsible for the smooth running of thin films equipment and for maximising uptime. The successful candidate will be qualified to degree level and have strong equipment engineering experience including significant experience in thin films. Additional skills should include experience with 8 semiconductor manufacturing at 0.35um or below. Familiarity with Novellus CVD, applied PVD & CVD and /or AST RTP are required. Please contact us to discuss further. 
skills Thin films, Engineer, IC, Equipment, semiconductor manufacturing, maintenance
Semiconductor Integration Engineer: posted on 03/11/2003
location UK Not specified, South West, United Kingdom
description Our client is a busy, growing design and fabrication organisation with an international presence. With a fab based in South West UK, they are now seeking an integration engineer. The successful candidate will be responsible for the development of advanced power MOSEFT products including yield improvement and inline data correlations for process mapping. Main responsibilities include: - New product transfer into high volume wafer fab manufacturing - Yield control and improvement on advanced power MOSFET products - Interface with assembly sites for yield improvement - Test vehicle development for process mapping Please contact us to discuss further. 
skills Engineer, IC, MOSFET, integration, semiconductor manufacturing, yield enhancement, process.
Quality and Failure Analysis Engineer: posted on 03/11/2003
location UK Not specified, South West, United Kingdom
description Our client is a busy, growing design and fabrication organisation with an international presence. With a fab based in South West UK, they are now seeking a quality and failure analysis engineer. The successful candidate will be responsible for the development of 8D corrective action reports for both customer and assembly/test complaints. Main responsibilities will also include defect analysis of in-line material from manufacturing/R&D using state of the art equipment. Quality and failure analysis experience within the semiconductor environment is necessary, in addition to a scientific/engineering degree. Problem solving, product engineering and 8D problem solving are advantageous, as would specific MOSFET experience. Please contact us to discuss further. 
skills Engineer, IC, MOSFET, quality, semiconductor manufacturing, failure analysis, 8D.
Device/Process Engineer - MOS / Bipolar ICs: posted on 03/11/2003
location UK Cambridge, Cambs, United Kingdom
description Excellent pre-IPO opportunity. Our client has developed a power IC technology with clear advantages over the nearest competition, and now seek a device / process engineer with specific MOS and bipolar device experience. Our client is a fabless IC company, therefore the successful candidate will work with the company's foundry partners on the manufacturing process. A key requirement will be to design devices / processes for performance, manufacturability and reliability optimisation. You must have good MOS / bipolar device experience, with a history of introducing new process modules in a fabrication environment. Knowledge of high voltage / power devices, as well as DRIE, would be beneficial. This is an excellent opportunity to become involved at the initial stages of a company with a great deal of promise. Please contact us to discuss. 
skills MOS / bipolar / high voltage device and process semiconductor engineering. Process module implemenation / device engineering of Power ICs
IC Process Engineers - Photolith: posted on 03/11/2003
location UK N/a, Eastern Europe, United Kingdom
description Our client is a leading international semiconductor organisation with a busy fab in Eastern Europe. Recent strong financial results mean that the company is optimistic about the market, and growing. They now seek a senior IC process engineer with strong photolithography experience (BiCMOS or BCD sub-micron technologies). Experience with Nikon equipment (G-7, G-8) is essential, as are good communication skills. This is a long term contract role, with good scope for being exposed to new technical challenges and new technologies. Good remuneration package is on offer. Please contact Neil Dickins to discuss in detail. 
skills Semiconductor, fabrication, IC, process, engineer, photolith, photolithography, lithography, contract, G-line steppers, Nikon
IC Process Engineers - Etch: posted on 03/11/2003
location UK N/a, Eastern Europe, United Kingdom
description Our client is a leading international semiconductor organisation with a busy fab in Eastern Europe. Recent strong financial results mean that the company is optimistic about the market, and growing. They now seek a senior IC process engineer with specific background in etch technologies (nitride, poly si, oxide, etc). Some exposure to LAM equipment is essential, as are good personal communication skills. This is a long term contract role, with good scope for being exposed to technical challenge and new technologies. Good remuneration package is on offer. Please contact Neil Dickins to discuss in detail. 
skills Semiconductor, fabrication, IC, process, engineer, etch, dry and wet processes, LAM, contract
Senior IC Layout Engineer: posted on 03/11/2003
location UK Cambridge, Cambridgeshire, United Kingdom
description Our client seeks an experienced Physical /Layout design engineer for Full Custom CMOS layout of complex RF/Analogue mixed mode ASICs for wireless communications. You will aid and assist the Head of Physical Design in the layout, top level assembly and tape out of RF/Analogue mixed mode ASICs in a number of Deep Sub Micron CMOS technologies. Main tasks will include:- <li>Tape out completed database and all the associated documentation and checks. <li>Floor planning of complete chips/complex blocks. <li>Generation of Outline Cell for digital Place and Route tools and Padring. <li>Layout of complex/critical blocks and cells. <li>Full verification of all of the above. <li>Understand and set up new fabrication processes/design rules as they are adopted. <li>Provide quick and accurate chip size estimates based on what if criteria. <li>Guide, advise and train members of the design team in best layout practice. Ideally you will have five plus years experience (more preferably) of CMOS Deep Sub Micron (0.18um and 0.13um) Full Custom IC layout and verification. This will range from the layout of standard library cells, through RF/Analogue block level, to top level pad ring and final chip assembly, verification and tape out. Experience in the following tools is sought:- <li>Full Custom Tools: Tanner - L-Edit, Avanti - Enterprise, Mentor Graphics - IC Station, Cadence <li>Verification Tools: Calibre, Dracula, Diva, xCalibre, Star RC-XT <li>You must also be able to demonstrate expertise of the use and interpretation of DRC, LVS and back annotated extraction results. In addition the candidate will have previous experience in configuring and developing CAD tools and process set up, have the ability to work independently, or part of a team or be able to lead a small group. Experience with C, C++, or Skill would be advantageous. Additional programming language skills (C, C++, Skill) to be considered an advantage. A competitive salary is on offer including share options, non-contributory pension, medical insurance & health insurance. 
skills mixed-signal, analog IC Layout, Tanner - L-Edit, Avanti - Enterprise, Mentor Graphics - IC Station, Calibre, Dracula, Diva, xCalibre, Star RC-XT
Mechanical Service Engineer: posted on 30/10/2003
location England Middlesex, Essex, London, Surrey
description Our established Essex based Security focused client is currently seeking a highly experienced hands on mechanical engineer from one of the following industry backgrounds; Lift Engineering, Steel Fabrication, Automated Gates, Plant Maintenance, Fabrication or Welding. You will be a qualified mechanical engineer and have automated gate installation or service experience or be willing to use your existing mechanical engineering skills to learn and train within the automated gate industry.
skills Lift, Engineering, Service, Installation, Commissioning, Mechanical, Automated, Gate, Barrier
Mechanical Service Engineer: posted on 30/10/2003
location Greater London Strand
description Our established Essex based Security focused client is currently seeking a highly experienced hands on mechanical engineer from one of the following industry backgrounds; Lift Engineering, Steel Fabrication, Automated Gates, Plant Maintenance, Fabrication or Welding. You will be a qualified mechanical engineer and have automated gate installation or service experience or be willing to use your existing mechanical engineering skills to learn and train within the automated gate industry.
skills Ideal candidates will reside in London or surrounding counties and be flexible with regards to working hours. Excellent opportunities and packages on offer.
Graduate Structural Engineer: posted on 24/10/2003
location Berkshire Reading, Berkshire
description Graduate Structural Engineer Reading, Berkshire Graduate Pack Formative role for keen graduate. International organisation needs to grow team from the bottom up. Areas include structural engineering, bridges, steel fabrication & construction, portal frames etc. Ideally looking for an applicable final year project and/or industrial year, don't be put off if you think this is the role for you. Contact me and tell me why I should consider you! *** Hundreds of jobs at www.remjobs.co.uk ***
skills Structural engineering, bridges, bridging, steel fabrication, steel construction, portal frames, steel structures.
Service/Maintenance Engineer: posted on 24/10/2003
location Staffordshire East Staffordshire
description Our client, a leading machine hire company with a network coverage throughout the UK, require a Service/Maintenance Engineer to work within their Northants operational depot. Initially working with a small team of 4 to 5 people you will have the following mechanical experience. 1. Mechanical Engineering skills including hydraulic, fabrication, diesel engines. 2. Basic Electrical fault finding. Ideally you will have come from a Power Access, Fork lift truck background having IPAF operators’ licence. Salary: £20,000 Basic (£25,000 inc bonus & overtime)
skills Qualifications Required: Mechanical Engineering Experience Certificate in Plant Engineering
RF/IC Engineer: posted on 23/10/2003
location England Various positions throught the UK - Scotland, Midl
description Working within a millimeter wave Integrated Circuit environment, the successful candidate will be working on the design and test of MMIC’s, the role will also involve the fabrication and tuning of module packaging for MMIC’s. Analogue IC candidates also considered.
skills Experience of RF on Chip testing of MMIC’s or RF testing of completed MMIC modules: Analogue IC candidates experience of BIPOLAR Technologies; RF, IC, MMIC, Bipolar
Mechanical Service Engineer: posted on 22/10/2003
location England Middlesex, Essex, London, Surrey
description Our established Essex based Security focused client is currently seeking a highly experienced hands on mechanical engineer from one of the following industry backgrounds; Lift Engineering, Steel Fabrication, Automated Gates, Plant Maintenance, Fabrication or Welding. You will be a qualified mechanical engineer and have automated gate installation or service experience or be willing to use your existing mechanical engineering skills to learn and train within the automated gate industry.
skills Lift, Engineering, Service, Installation, Commissioning, Mechanical, Automated, Gate, Barrier
RF/IC Engineer: posted on 10/10/2003
location England Various positions throught the UK - Scotland, Midl
description Working within a millimeter wave Integrated Circuit environment, the successful candidate will be working on the design and test of MMIC’s, the role will also involve the fabrication and tuning of module packaging for MMIC’s. Analogue IC candidates also considered.
skills Experience of RF on Chip testing of MMIC’s or RF testing of completed MMIC modules: Analogue IC candidates experience of BIPOLAR Technologies; RF, IC, MMIC, Bipolar
RF/IC Engineer: posted on 03/10/2003
location England Various positions throught the UK - Scotland, Midl
description Working within a millimeter wave Integrated Circuit environment, the successful candidate will be working on the design and test of MMIC’s, the role will also involve the fabrication and tuning of module packaging for MMIC’s. Analogue IC candidates also considered.
skills Experience of RF on Chip testing of MMIC’s or RF testing of completed MMIC modules: Analogue IC candidates experience of BIPOLAR Technologies; RF, IC, MMIC, Bipolar
Mechanical Service Engineer: posted on 30/09/2003
location Greater London Strand
description Our established Essex based Security focused client is currently seeking a highly experienced hands on mechanical engineer from one of the following industry backgrounds; Lift Engineering, Steel Fabrication, Automated Gates, Plant Maintenance, Fabrication or Welding. You will be a qualified mechanical engineer and have automated gate installation or service experience or be willing to use your existing mechanical engineering skills to learn and train within the automated gate industry.
skills Ideal candidates will reside in London or surrounding counties and be flexible with regards to working hours. Excellent opportunities and packages on offer.
RF/IC Engineer: posted on 26/09/2003
location England Various positions throught the UK - Scotland, Midl
description Working within a millimeter wave Integrated Circuit environment, the successful candidate will be working on the design and test of MMIC’s, the role will also involve the fabrication and tuning of module packaging for MMIC’s. Analogue IC candidates also considered.
skills Experience of RF on Chip testing of MMIC’s or RF testing of completed MMIC modules: Analogue IC candidates experience of BIPOLAR Technologies; RF, IC, MMIC, Bipolar
Graduate Structural Engineer: posted on 19/09/2003
location Berkshire Reading, Berkshire
description Graduate Structural Engineer Reading, Berkshire Graduate Pack Formative role for keen graduate. International organisation needs to grow team from the bottom up. Areas include structural engineering, bridges, steel fabrication & construction, portal frames etc. Ideally looking for an applicable final year project and/or industrial year, don't be put off if you think this is the role for you. Contact me and tell me why I should consider you! *** Hundreds of jobs at www.remjobs.co.uk ***
skills Structural engineering, bridges, bridging, steel fabrication, steel construction, portal frames, steel structures.
RF/IC Engineer: posted on 19/09/2003
location England Various positions throught the UK - Scotland, Midl
description Working within a millimeter wave Integrated Circuit environment, the successful candidate will be working on the design and test of MMIC’s, the role will also involve the fabrication and tuning of module packaging for MMIC’s. Analogue IC candidates also considered.
skills Experience of RF on Chip testing of MMIC’s or RF testing of completed MMIC modules: Analogue IC candidates experience of BIPOLAR Technologies; RF, IC, MMIC, Bipolar
RF/IC Engineer: posted on 04/09/2003
location England .
description Working within a millimeter wave Integrated Circuit environment, the successful candidate will be working on the design and test of MMIC’s, the role will also involve the fabrication and tuning of module packaging for MMIC’s. Analogue IC candidates also considered.
skills Experience of RF on Chip testing of MMIC’s or RF testing of completed MMIC modules: Analogue IC candidates experience of BIPOLAR Technologies; RF, IC, MMIC, Bipolar
Graduate Structural Engineer: posted on 28/08/2003
location West Midlands (Birmingham) Reading, Berkshire
description Graduate Structural Engineer Reading, Berkshire Graduate Pack Excellent formative role for keen graduate. International organisation needs to grow the team from the bottom up. Areas of interest include structural engineering, bridges, bridging, steel fabrication, steel construction, portal frames etc. Ideally looking for an applicable final year project and/or industrial year, don't be put off if you think this is the role for you. Contact me and tell me why I should consider you!
skills Structural engineering, bridges, bridging, steel fabrication, steel construction, portal frames, steel structures.
Camera Module Designer: posted on 28/08/2003
location Overseas USA - Clinton
description Our client is a leading edge, medium sized company making solid profits!! They are a world leader in the development of power management, audio and more recently imaging semiconductor technology. Due to their continued success within the wireless and automotive field they are investing in new development areas, namely Imaging technology. With new and innovative products already released they want to further strengthen and expand this part of the business. To fuel this growth they have an immediate requirement for a Camera Module Designer. Description: <li>A team working on state of the art camera on a chip technology is seeking an experienced module and packaging engineer to provide high value solutions. The qualified candidate will develop packaging and modules to comply with the physical electro optical, and environmental specifications. Modules typically consist of lens/optics, housings, PCB and connectors. Working with the imaging ASIC designers, the qualified candidate will provide an efficient low-noise vision system directly coupled into the client hardware. Responsibilities: <li>Develop prototype drawings for camera module assemblies on schedule and compliant with technical specifications. <li>Work with ASIC designers for efficient overall system design. <li>Work with Optical design team to provide innovative electro optic solutions. <li>Generate accurate specifications based upon client requirements and provide accurate CAD drawings to the Operations Group for sample fabrication. <li>Assist operations group in production and sourcing issues. <li>Execute on multiple concurrent designs and test structure developments. Skills required: <li>Candidates will ideally have a minimum of 5 years experience in a camera based product development group performing detailed CAD. <li>ProEngineer, AutoCAD, Cadence and OrCAD experience preferred. <li>Knowledge of current low-noise PCB development and rapid prototyping mechanical housing methods. <li>BSEE or BSME required (Advanced degree preferred). <li>Demonstrated innovation in leading edge vision systems and IP generation. <li>Good verbal and written English is required. Excellent salary and benefit packages, including profit-based bonus and share options await the right individuals.
skills Camera Module Designer, 5 years experience in a camera based product development group performing detailed CAD.
IC Manufacturing Engineer – Site Support: posted on 28/08/2003
location Avon
description Our client is a leading mixed signal IC design / development organisation with an impressive track record of right first time silicon. This commitment to quality has been an important ingredient in their recipe for success, which has resulted in significant growth and new order wins, in the face of the recent industry downturn. Their emphasis on quality is of course strong at the manufacturing / prototype development stage, which is where you fit in. Our client is seeking a Site Support Engineer to support the test and manufacturing function within their primary test and assembly subcontract house. Acting as the liaison between our client and the subcontract house, responsibilities will include overseeing and inspecting shipments, monitoring cycle time targets, ensuring timely acceptance of spec by the subcontractor, providing engineering support and resolving / negotiating any potential conflicts. The successful candidate will have experience of semiconductor manufacturing, experience of a subcontract manufacturing environment., and familiarity with qualification procedures. An understanding of volume test environments is also essential. Please contact us to discuss your interest in this role.
skills IC manufacturing professional with good experience across assembly, test and operations. Fabrication / subcontract IC experience essential.
Digital Evaluation Engineer: posted on 28/08/2003
location Overseas Germany - Munich
description Our client is a leading edge, medium sized company making solid profits!! They are a world leader in the development of power management, audio and more recently imaging semiconductor technology. Due to their continued success within the wireless and automotive field they are investing in new development areas, namely Imaging technology. With new and innovative products already released they want to further strengthen and expand this part of the business. To fuel this growth they have an immediate requirement for a Digital Evaluation Engineer. Description: <li>Working in a dynamic environment, this position provides the opportunity to work with a team developing state of the art mixed signal systems on chips. Developing hardware and software suites to test and verify digital circuit operation for implementation as ASICs and digital IP cores, the engineer will provide early proof of algorithm operation. These results will be compared with circuit simulations for design verification. After device fabrication, complete evaluation and documentation of the prototype parts performance will be performed by this engineer. Responsibilities: <li>Development of hardware and software for evaluating digital ASIC cores and ASIC devices. <li>Work with digital designers and system engineers throughout development cycle. <li>Provide FPGA based emulation of digital circuits for ASIC verification and system development. <li>Assist in algorithm development and debug. Skills required: <li>Candidates will ideally have a minimum of 5 years experience in a CMOS, mixed-signal design or high speed FPGA based environment.<li>Object oriented coding, IDL, Altera/Xilinx development tools Cadence a plus. <li>Laboratory equipment such as power supplies, oscilloscopes, logic analyzers, etc. for digital electronic testing at up to 400MHz. <li>Must be able to work independently as well as in a team, be highly organized, and have good communication skills. <li>Good verbal and written English is required. Excellent salary and benefit packages, including profit-based bonus and share options await the right individuals.
skills Digital Evaluation Engineer , 5 years experience in a CMOS, mixed-signal design or high speed PGA based environment, Object oriented coding, IDL, Altera/Xilinx development tools Cadence a plus
Product Marketing Engineer - Wafer Fab: posted on 28/08/2003
location Overseas Germany
description We are currently working with a client in Germany seeking a Product Marketing Engineer with specific experience of working in a semiconductor fabrication environment. As the main contact between clients and the technology service teams, this role requires an engineering-oriented individual with excellent customer skills. The prime responsibility is to act as the creator of the product offering, and to support that offering throughout the marketing cycle, from development to sale and post sales support. Tracking industry trends and identifying target markets and customer groups for this expanding business, the successful candidate will develop technical data sheets for a wide range of semiconductor manufacturing services, and will need to have a strong understanding of semiconductor technologies and fab manufacturing techniques. Exposure to Mixed Signal IC technologies would be ideal. This is a challenging role within a busy and growing organisation based in Germany. Strong English communication skills essential, German skills not essential, though a willingness to start learning is required! Please contact to discuss further or email neil@ic-resources.co.uk
skills Product marketing engineer with specific experience of semiconductor fabrication / manufacturing. Mixed signal experience beneficial. German fab, expanding company.
IC Process Development Engineer: posted on 28/08/2003
location Overseas Germany
description Here is an opportunity for a process development engineer to join an expanding, established fab in Germany, which is currently outperforming its Far Eastern counterparts. The successful candidate will be a semiconductor process engineer with specific development experience in a mixed signal environment. Adding new processes and modules to existing process, your statistical analysis and device simulation experience will be called upon within this busy team. Knowledge of semiconductor physics / processes is of course required, as are good English communication skills. Please contact us immediately to discuss.
skills IC process development engineer with good semiconductor physics / simulation experience in a mixed signal fabrication environment. Based Germany.
Camera Module Designer: posted on 21/08/2003
location Overseas USA - Clinton
description Our client is a leading edge, medium sized company making solid profits!! They are a world leader in the development of power management, audio and more recently imaging semiconductor technology. Due to their continued success within the wireless and automotive field they are investing in new development areas, namely Imaging technology. With new and innovative products already released they want to further strengthen and expand this part of the business. To fuel this growth they have an immediate requirement for a Camera Module Designer. Description: <li>A team working on state of the art camera on a chip technology is seeking an experienced module and packaging engineer to provide high value solutions. The qualified candidate will develop packaging and modules to comply with the physical electro optical, and environmental specifications. Modules typically consist of lens/optics, housings, PCB and connectors. Working with the imaging ASIC designers, the qualified candidate will provide an efficient low-noise vision system directly coupled into the client hardware. Responsibilities: <li>Develop prototype drawings for camera module assemblies on schedule and compliant with technical specifications. <li>Work with ASIC designers for efficient overall system design. <li>Work with Optical design team to provide innovative electro optic solutions. <li>Generate accurate specifications based upon client requirements and provide accurate CAD drawings to the Operations Group for sample fabrication. <li>Assist operations group in production and sourcing issues. <li>Execute on multiple concurrent designs and test structure developments. Skills required: <li>Candidates will ideally have a minimum of 5 years experience in a camera based product development group performing detailed CAD. <li>ProEngineer, AutoCAD, Cadence and OrCAD experience preferred. <li>Knowledge of current low-noise PCB development and rapid prototyping mechanical housing methods. <li>BSEE or BSME required (Advanced degree preferred). <li>Demonstrated innovation in leading edge vision systems and IP generation. <li>Good verbal and written English is required. Excellent salary and benefit packages, including profit-based bonus and share options await the right individuals.
skills Camera Module Designer, 5 years experience in a camera based product development group performing detailed CAD.
Digital Evaluation Engineer: posted on 21/08/2003
location Overseas Germany - Munich
description Our client is a leading edge, medium sized company making solid profits!! They are a world leader in the development of power management, audio and more recently imaging semiconductor technology. Due to their continued success within the wireless and automotive field they are investing in new development areas, namely Imaging technology. With new and innovative products already released they want to further strengthen and expand this part of the business. To fuel this growth they have an immediate requirement for a Digital Evaluation Engineer. Description: <li>Working in a dynamic environment, this position provides the opportunity to work with a team developing state of the art mixed signal systems on chips. Developing hardware and software suites to test and verify digital circuit operation for implementation as ASICs and digital IP cores, the engineer will provide early proof of algorithm operation. These results will be compared with circuit simulations for design verification. After device fabrication, complete evaluation and documentation of the prototype parts performance will be performed by this engineer. Responsibilities: <li>Development of hardware and software for evaluating digital ASIC cores and ASIC devices. <li>Work with digital designers and system engineers throughout development cycle. <li>Provide FPGA based emulation of digital circuits for ASIC verification and system development. <li>Assist in algorithm development and debug. Skills required: <li>Candidates will ideally have a minimum of 5 years experience in a CMOS, mixed-signal design or high speed FPGA based environment.<li>Object oriented coding, IDL, Altera/Xilinx development tools Cadence a plus. <li>Laboratory equipment such as power supplies, oscilloscopes, logic analyzers, etc. for digital electronic testing at up to 400MHz. <li>Must be able to work independently as well as in a team, be highly organized, and have good communication skills. <li>Good verbal and written English is required. Excellent salary and benefit packages, including profit-based bonus and share options await the right individuals.
skills Digital Evaluation Engineer , 5 years experience in a CMOS, mixed-signal design or high speed PGA based environment, Object oriented coding, IDL, Altera/Xilinx development tools Cadence a plus
IC Manufacturing Engineer – Site Support: posted on 21/08/2003
location Avon
description Our client is a leading mixed signal IC design / development organisation with an impressive track record of right first time silicon. This commitment to quality has been an important ingredient in their recipe for success, which has resulted in significant growth and new order wins, in the face of the recent industry downturn. Their emphasis on quality is of course strong at the manufacturing / prototype development stage, which is where you fit in. Our client is seeking a Site Support Engineer to support the test and manufacturing function within their primary test and assembly subcontract house. Acting as the liaison between our client and the subcontract house, responsibilities will include overseeing and inspecting shipments, monitoring cycle time targets, ensuring timely acceptance of spec by the subcontractor, providing engineering support and resolving / negotiating any potential conflicts. The successful candidate will have experience of semiconductor manufacturing, experience of a subcontract manufacturing environment., and familiarity with qualification procedures. An understanding of volume test environments is also essential. Please contact us to discuss your interest in this role.
skills IC manufacturing professional with good experience across assembly, test and operations. Fabrication / subcontract IC experience essential.
IC Process Development Engineer: posted on 21/08/2003
location Overseas Germany
description Here is an opportunity for a process development engineer to join an expanding, established fab in Germany, which is currently outperforming its Far Eastern counterparts. The successful candidate will be a semiconductor process engineer with specific development experience in a mixed signal environment. Adding new processes and modules to existing process, your statistical analysis and device simulation experience will be called upon within this busy team. Knowledge of semiconductor physics / processes is of course required, as are good English communication skills. Please contact us immediately to discuss.
skills IC process development engineer with good semiconductor physics / simulation experience in a mixed signal fabrication environment. Based Germany.
Product Marketing Engineer - Wafer Fab: posted on 21/08/2003
location Overseas Germany
description We are currently working with a client in Germany seeking a Product Marketing Engineer with specific experience of working in a semiconductor fabrication environment. As the main contact between clients and the technology service teams, this role requires an engineering-oriented individual with excellent customer skills. The prime responsibility is to act as the creator of the product offering, and to support that offering throughout the marketing cycle, from development to sale and post sales support. Tracking industry trends and identifying target markets and customer groups for this expanding business, the successful candidate will develop technical data sheets for a wide range of semiconductor manufacturing services, and will need to have a strong understanding of semiconductor technologies and fab manufacturing techniques. Exposure to Mixed Signal IC technologies would be ideal. This is a challenging role within a busy and growing organisation based in Germany. Strong English communication skills essential, German skills not essential, though a willingness to start learning is required! Please contact to discuss further or email neil@ic-resources.co.uk
skills Product marketing engineer with specific experience of semiconductor fabrication / manufacturing. Mixed signal experience beneficial. German fab, expanding company.
TEAM LEADER / HEAD OF PERMANENT WAY ENGINEERING: posted on 15/08/2003
location West Midlands Solihull
description QUALIFICATIONS Fellow of the Permanent Way Institution. Incorporated or (preferably) Chartered Engineer. EXPERIENCE Likely to have had at least fifteen years maintenance, renewal, and/or enhancements experience in a railway infrastructure company, major consultant, or major contractor, with the majority of this being spent on permanent way work. Considerable hands-on experience of permanent way design and calculation, using a variety of software packages. Sound knowledge of permanent way design principles, Standards, components, and fabrication. Experience of planning and managing permanent way construction and installation. Good appreciation of railway systems, and the key interactions between permanent way and other railway assets, and with railway operating practices.
skills Permanent, way
RF/IC Engineer: posted on 15/08/2003
location West Midlands (Birmingham) Midlands
description Working within a millimeter wave Integrated Circuit environment, the successful candidate will be working on the design and test of MMIC’s, the role will also involve the fabrication and tuning of module packaging for MMIC’s. Analogue IC candidates also considered.
skills Experience of RF on Chip testing of MMIC’s or RF testing of completed MMIC modules: Analogue IC candidates experience of BIPOLAR Technologies; RF, IC, MMIC, Bipolar
Camera Module Designer: posted on 13/08/2003
location Overseas USA - Clinton
description Our client is a leading edge, medium sized company making solid profits!! They are a world leader in the development of power management, audio and more recently imaging semiconductor technology. Due to their continued success within the wireless and automotive field they are investing in new development areas, namely Imaging technology. With new and innovative products already released they want to further strengthen and expand this part of the business. To fuel this growth they have an immediate requirement for a Camera Module Designer. Description: <li>A team working on state of the art camera on a chip technology is seeking an experienced module and packaging engineer to provide high value solutions. The qualified candidate will develop packaging and modules to comply with the physical electro optical, and environmental specifications. Modules typically consist of lens/optics, housings, PCB and connectors. Working with the imaging ASIC designers, the qualified candidate will provide an efficient low-noise vision system directly coupled into the client hardware. Responsibilities: <li>Develop prototype drawings for camera module assemblies on schedule and compliant with technical specifications. <li>Work with ASIC designers for efficient overall system design. <li>Work with Optical design team to provide innovative electro optic solutions. <li>Generate accurate specifications based upon client requirements and provide accurate CAD drawings to the Operations Group for sample fabrication. <li>Assist operations group in production and sourcing issues. <li>Execute on multiple concurrent designs and test structure developments. Skills required: <li>Candidates will ideally have a minimum of 5 years experience in a camera based product development group performing detailed CAD. <li>ProEngineer, AutoCAD, Cadence and OrCAD experience preferred. <li>Knowledge of current low-noise PCB development and rapid prototyping mechanical housing methods. <li>BSEE or BSME required (Advanced degree preferred). <li>Demonstrated innovation in leading edge vision systems and IP generation. <li>Good verbal and written English is required. Excellent salary and benefit packages, including profit-based bonus and share options await the right individuals.
skills Camera Module Designer, 5 years experience in a camera based product development group performing detailed CAD.
Digital Evaluation Engineer: posted on 13/08/2003
location Overseas Germany - Munich
description Our client is a leading edge, medium sized company making solid profits!! They are a world leader in the development of power management, audio and more recently imaging semiconductor technology. Due to their continued success within the wireless and automotive field they are investing in new development areas, namely Imaging technology. With new and innovative products already released they want to further strengthen and expand this part of the business. To fuel this growth they have an immediate requirement for a Digital Evaluation Engineer. Description: <li>Working in a dynamic environment, this position provides the opportunity to work with a team developing state of the art mixed signal systems on chips. Developing hardware and software suites to test and verify digital circuit operation for implementation as ASICs and digital IP cores, the engineer will provide early proof of algorithm operation. These results will be compared with circuit simulations for design verification. After device fabrication, complete evaluation and documentation of the prototype parts performance will be performed by this engineer. Responsibilities: <li>Development of hardware and software for evaluating digital ASIC cores and ASIC devices. <li>Work with digital designers and system engineers throughout development cycle. <li>Provide FPGA based emulation of digital circuits for ASIC verification and system development. <li>Assist in algorithm development and debug. Skills required: <li>Candidates will ideally have a minimum of 5 years experience in a CMOS, mixed-signal design or high speed FPGA based environment.<li>Object oriented coding, IDL, Altera/Xilinx development tools Cadence a plus. <li>Laboratory equipment such as power supplies, oscilloscopes, logic analyzers, etc. for digital electronic testing at up to 400MHz. <li>Must be able to work independently as well as in a team, be highly organized, and have good communication skills. <li>Good verbal and written English is required. Excellent salary and benefit packages, including profit-based bonus and share options await the right individuals.
skills Digital Evaluation Engineer , 5 years experience in a CMOS, mixed-signal design or high speed PGA based environment, Object oriented coding, IDL, Altera/Xilinx development tools Cadence a plus
IC Manufacturing Engineer – Site Support: posted on 13/08/2003
location Avon
description Our client is a leading mixed signal IC design / development organisation with an impressive track record of right first time silicon. This commitment to quality has been an important ingredient in their recipe for success, which has resulted in significant growth and new order wins, in the face of the recent industry downturn. Their emphasis on quality is of course strong at the manufacturing / prototype development stage, which is where you fit in. Our client is seeking a Site Support Engineer to support the test and manufacturing function within their primary test and assembly subcontract house. Acting as the liaison between our client and the subcontract house, responsibilities will include overseeing and inspecting shipments, monitoring cycle time targets, ensuring timely acceptance of spec by the subcontractor, providing engineering support and resolving / negotiating any potential conflicts. The successful candidate will have experience of semiconductor manufacturing, experience of a subcontract manufacturing environment., and familiarity with qualification procedures. An understanding of volume test environments is also essential. Please contact us to discuss your interest in this role.
skills IC manufacturing professional with good experience across assembly, test and operations. Fabrication / subcontract IC experience essential.
Product Marketing Engineer - Wafer Fab: posted on 13/08/2003
location Overseas Germany
description We are currently working with a client in Germany seeking a Product Marketing Engineer with specific experience of working in a semiconductor fabrication environment. As the main contact between clients and the technology service teams, this role requires an engineering-oriented individual with excellent customer skills. The prime responsibility is to act as the creator of the product offering, and to support that offering throughout the marketing cycle, from development to sale and post sales support. Tracking industry trends and identifying target markets and customer groups for this expanding business, the successful candidate will develop technical data sheets for a wide range of semiconductor manufacturing services, and will need to have a strong understanding of semiconductor technologies and fab manufacturing techniques. Exposure to Mixed Signal IC technologies would be ideal. This is a challenging role within a busy and growing organisation based in Germany. Strong English communication skills essential, German skills not essential, though a willingness to start learning is required! Please contact to discuss further or email neil@ic-resources.co.uk
skills Product marketing engineer with specific experience of semiconductor fabrication / manufacturing. Mixed signal experience beneficial. German fab, expanding company.
IC Process Development Engineer: posted on 13/08/2003
location Overseas Germany
description Here is an opportunity for a process development engineer to join an expanding, established fab in Germany, which is currently outperforming its Far Eastern counterparts. The successful candidate will be a semiconductor process engineer with specific development experience in a mixed signal environment. Adding new processes and modules to existing process, your statistical analysis and device simulation experience will be called upon within this busy team. Knowledge of semiconductor physics / processes is of course required, as are good English communication skills. Please contact us immediately to discuss.
skills IC process development engineer with good semiconductor physics / simulation experience in a mixed signal fabrication environment. Based Germany.
RF/IC Engineer: posted on 07/08/2003
location West Midlands (Birmingham) Midlands
description Working within a millimeter wave Integrated Circuit environment, the successful candidate will be working on the design and test of MMIC’s, the role will also involve the fabrication and tuning of module packaging for MMIC’s. Analogue IC candidates also considered.
skills Experience of RF on Chip testing of MMIC’s or RF testing of completed MMIC modules: Analogue IC candidates experience of BIPOLAR Technologies; RF, IC, MMIC, Bipolar
Camera Module Designer: posted on 05/08/2003
location Overseas USA - Clinton
description Our client is a leading edge, medium sized company making solid profits!! They are a world leader in the development of power management, audio and more recently imaging semiconductor technology. Due to their continued success within the wireless and automotive field they are investing in new development areas, namely Imaging technology. With new and innovative products already released they want to further strengthen and expand this part of the business. To fuel this growth they have an immediate requirement for a Camera Module Designer. Description: <li>A team working on state of the art camera on a chip technology is seeking an experienced module and packaging engineer to provide high value solutions. The qualified candidate will develop packaging and modules to comply with the physical electro optical, and environmental specifications. Modules typically consist of lens/optics, housings, PCB and connectors. Working with the imaging ASIC designers, the qualified candidate will provide an efficient low-noise vision system directly coupled into the client hardware. Responsibilities: <li>Develop prototype drawings for camera module assemblies on schedule and compliant with technical specifications. <li>Work with ASIC designers for efficient overall system design. <li>Work with Optical design team to provide innovative electro optic solutions. <li>Generate accurate specifications based upon client requirements and provide accurate CAD drawings to the Operations Group for sample fabrication. <li>Assist operations group in production and sourcing issues. <li>Execute on multiple concurrent designs and test structure developments. Skills required: <li>Candidates will ideally have a minimum of 5 years experience in a camera based product development group performing detailed CAD. <li>ProEngineer, AutoCAD, Cadence and OrCAD experience preferred. <li>Knowledge of current low-noise PCB development and rapid prototyping mechanical housing methods. <li>BSEE or BSME required (Advanced degree preferred). <li>Demonstrated innovation in leading edge vision systems and IP generation. <li>Good verbal and written English is required. Excellent salary and benefit packages, including profit-based bonus and share options await the right individuals.
skills Camera Module Designer, 5 years experience in a camera based product development group performing detailed CAD.
Digital Evaluation Engineer: posted on 05/08/2003
location Overseas Germany - Munich
description Our client is a leading edge, medium sized company making solid profits!! They are a world leader in the development of power management, audio and more recently imaging semiconductor technology. Due to their continued success within the wireless and automotive field they are investing in new development areas, namely Imaging technology. With new and innovative products already released they want to further strengthen and expand this part of the business. To fuel this growth they have an immediate requirement for a Digital Evaluation Engineer. Description: <li>Working in a dynamic environment, this position provides the opportunity to work with a team developing state of the art mixed signal systems on chips. Developing hardware and software suites to test and verify digital circuit operation for implementation as ASICs and digital IP cores, the engineer will provide early proof of algorithm operation. These results will be compared with circuit simulations for design verification. After device fabrication, complete evaluation and documentation of the prototype parts performance will be performed by this engineer. Responsibilities: <li>Development of hardware and software for evaluating digital ASIC cores and ASIC devices. <li>Work with digital designers and system engineers throughout development cycle. <li>Provide FPGA based emulation of digital circuits for ASIC verification and system development. <li>Assist in algorithm development and debug. Skills required: <li>Candidates will ideally have a minimum of 5 years experience in a CMOS, mixed-signal design or high speed FPGA based environment.<li>Object oriented coding, IDL, Altera/Xilinx development tools Cadence a plus. <li>Laboratory equipment such as power supplies, oscilloscopes, logic analyzers, etc. for digital electronic testing at up to 400MHz. <li>Must be able to work independently as well as in a team, be highly organized, and have good communication skills. <li>Good verbal and written English is required. Excellent salary and benefit packages, including profit-based bonus and share options await the right individuals.
skills Digital Evaluation Engineer , 5 years experience in a CMOS, mixed-signal design or high speed PGA based environment, Object oriented coding, IDL, Altera/Xilinx development tools Cadence a plus
IC Manufacturing Engineer – Site Support: posted on 05/08/2003
location Avon
description Our client is a leading mixed signal IC design / development organisation with an impressive track record of right first time silicon. This commitment to quality has been an important ingredient in their recipe for success, which has resulted in significant growth and new order wins, in the face of the recent industry downturn. Their emphasis on quality is of course strong at the manufacturing / prototype development stage, which is where you fit in. Our client is seeking a Site Support Engineer to support the test and manufacturing function within their primary test and assembly subcontract house. Acting as the liaison between our client and the subcontract house, responsibilities will include overseeing and inspecting shipments, monitoring cycle time targets, ensuring timely acceptance of spec by the subcontractor, providing engineering support and resolving / negotiating any potential conflicts. The successful candidate will have experience of semiconductor manufacturing, experience of a subcontract manufacturing environment., and familiarity with qualification procedures. An understanding of volume test environments is also essential. Please contact us to discuss your interest in this role.
skills IC manufacturing professional with good experience across assembly, test and operations. Fabrication / subcontract IC experience essential.
Product Marketing Engineer - Wafer Fab: posted on 05/08/2003
location Overseas Germany
description We are currently working with a client in Germany seeking a Product Marketing Engineer with specific experience of working in a semiconductor fabrication environment. As the main contact between clients and the technology service teams, this role requires an engineering-oriented individual with excellent customer skills. The prime responsibility is to act as the creator of the product offering, and to support that offering throughout the marketing cycle, from development to sale and post sales support. Tracking industry trends and identifying target markets and customer groups for this expanding business, the successful candidate will develop technical data sheets for a wide range of semiconductor manufacturing services, and will need to have a strong understanding of semiconductor technologies and fab manufacturing techniques. Exposure to Mixed Signal IC technologies would be ideal. This is a challenging role within a busy and growing organisation based in Germany. Strong English communication skills essential, German skills not essential, though a willingness to start learning is required! Please contact to discuss further or email neil@ic-resources.co.uk
skills Product marketing engineer with specific experience of semiconductor fabrication / manufacturing. Mixed signal experience beneficial. German fab, expanding company.
IC Process Development Engineer: posted on 05/08/2003
location Overseas Germany
description Here is an opportunity for a process development engineer to join an expanding, established fab in Germany, which is currently outperforming its Far Eastern counterparts. The successful candidate will be a semiconductor process engineer with specific development experience in a mixed signal environment. Adding new processes and modules to existing process, your statistical analysis and device simulation experience will be called upon within this busy team. Knowledge of semiconductor physics / processes is of course required, as are good English communication skills. Please contact us immediately to discuss.
skills IC process development engineer with good semiconductor physics / simulation experience in a mixed signal fabrication environment. Based Germany.
IC Process Development Engineer: posted on 31/07/2003
location Overseas Germany
description Here is an opportunity for a process development engineer to join an expanding, established fab in Germany, which is currently outperforming its Far Eastern counterparts. The successful candidate will be a semiconductor process engineer with specific development experience in a mixed signal environment. Adding new processes and modules to existing process, your statistical analysis and device simulation experience will be called upon within this busy team. Knowledge of semiconductor physics / processes is of course required, as are good English communication skills. Please contact us immediately to discuss.
skills IC process development engineer with good semiconductor physics / simulation experience in a mixed signal fabrication environment. Based Germany.
IC Manufacturing Engineer – Site Support: posted on 31/07/2003
location Avon
description Our client is a leading mixed signal IC design / development organisation with an impressive track record of right first time silicon. This commitment to quality has been an important ingredient in their recipe for success, which has resulted in significant growth and new order wins, in the face of the recent industry downturn. Their emphasis on quality is of course strong at the manufacturing / prototype development stage, which is where you fit in. Our client is seeking a Site Support Engineer to support the test and manufacturing function within their primary test and assembly subcontract house. Acting as the liaison between our client and the subcontract house, responsibilities will include overseeing and inspecting shipments, monitoring cycle time targets, ensuring timely acceptance of spec by the subcontractor, providing engineering support and resolving / negotiating any potential conflicts. The successful candidate will have experience of semiconductor manufacturing, experience of a subcontract manufacturing environment., and familiarity with qualification procedures. An understanding of volume test environments is also essential. Please contact us to discuss your interest in this role.
skills IC manufacturing professional with good experience across assembly, test and operations. Fabrication / subcontract IC experience essential.
Product Marketing Engineer - Wafer Fab: posted on 31/07/2003
location Overseas Germany
description We are currently working with a client in Germany seeking a Product Marketing Engineer with specific experience of working in a semiconductor fabrication environment. As the main contact between clients and the technology service teams, this role requires an engineering-oriented individual with excellent customer skills. The prime responsibility is to act as the creator of the product offering, and to support that offering throughout the marketing cycle, from development to sale and post sales support. Tracking industry trends and identifying target markets and customer groups for this expanding business, the successful candidate will develop technical data sheets for a wide range of semiconductor manufacturing services, and will need to have a strong understanding of semiconductor technologies and fab manufacturing techniques. Exposure to Mixed Signal IC technologies would be ideal. This is a challenging role within a busy and growing organisation based in Germany. Strong English communication skills essential, German skills not essential, though a willingness to start learning is required! Please contact to discuss further or email neil@ic-resources.co.uk
skills Product marketing engineer with specific experience of semiconductor fabrication / manufacturing. Mixed signal experience beneficial. German fab, expanding company.
Camera Module Designer: posted on 31/07/2003
location Overseas USA - Clinton
description Our client is a leading edge, medium sized company making solid profits!! They are a world leader in the development of power management, audio and more recently imaging semiconductor technology. Due to their continued success within the wireless and automotive field they are investing in new development areas, namely Imaging technology. With new and innovative products already released they want to further strengthen and expand this part of the business. To fuel this growth they have an immediate requirement for a Camera Module Designer. Description: <li>A team working on state of the art camera on a chip technology is seeking an experienced module and packaging engineer to provide high value solutions. The qualified candidate will develop packaging and modules to comply with the physical electro optical, and environmental specifications. Modules typically consist of lens/optics, housings, PCB and connectors. Working with the imaging ASIC designers, the qualified candidate will provide an efficient low-noise vision system directly coupled into the client hardware. Responsibilities: <li>Develop prototype drawings for camera module assemblies on schedule and compliant with technical specifications. <li>Work with ASIC designers for efficient overall system design. <li>Work with Optical design team to provide innovative electro optic solutions. <li>Generate accurate specifications based upon client requirements and provide accurate CAD drawings to the Operations Group for sample fabrication. <li>Assist operations group in production and sourcing issues. <li>Execute on multiple concurrent designs and test structure developments. Skills required: <li>Candidates will ideally have a minimum of 5 years experience in a camera based product development group performing detailed CAD. <li>ProEngineer, AutoCAD, Cadence and OrCAD experience preferred. <li>Knowledge of current low-noise PCB development and rapid prototyping mechanical housing methods. <li>BSEE or BSME required (Advanced degree preferred). <li>Demonstrated innovation in leading edge vision systems and IP generation. <li>Good verbal and written English is required. Excellent salary and benefit packages, including profit-based bonus and share options await the right individuals.
skills Camera Module Designer, 5 years experience in a camera based product development group performing detailed CAD.

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