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Working on III-V semiconductor Laser Diodes / LEDs you will apply power semiconductor packaging techniques of ceramic, flip-chip or BGA packages plus III-V chip specifics such as chip fragility/handling to the development of innovative package processing. MSc+ in Physics and experience in Optoelectronic Semiconductor Package manufacturing at a minimum level of Project or Product Management. Thermal Analysis, Device Characterisation and Luminair an advantage. More vacancies at www.remjobs.co.uk
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