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Must have a minimum of degree level education in electronics, chemistry or physics and 5 - 10 years of hands-on reliability stress qualification work covering dynamic burn in, THB, HAST, ESD and latch-up with a deep understanding and proven experience of:
· Semiconductor manufacturing processes and equipment.
· Semiconductor failure mechanisms such as those to be found from selective stress tests which expose weaknesses in areas such as transistor gates, polysilicon, metalisation, planarisation, passivation and bond pads.
· IC plastic encapsulation materials, production methods, processing weaknesses and reliability failure mechanisms, as well as failures induced in the die as a result of encapsulation.
· The practical benefits and challenges of performing reliability monitor testing with demonstrable experience of utilising the results to further improve the reliability of the materials being tested.
· How to optimise the device input biasing and output loading for maximum effect while in an accelerated stress test environment.
· How to guide failure analysis of subsequent fails.
· Team co-ordination, planning, reporting and motivating.
To apply for this position please contact Andrew Grier on 01698 527120 or AGrier@Redlineplc.com
For further details on this and many other vacancies visit our website at http://www.redlineplc.com
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