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A leading developer of sensors & detectors require a Packaging Process Engineer to carry out the hands-on packaging of devices. Hands-on experience with two or more of the following packaging processes is required: wire bonding, encapsulation, capping, die attach, epoxy attach, or hermitic sealing. Experience with Chip-On-Board, MCM, PCB substrates, ceramic substrates, or TO packaging would also be advantageous. You should have a HND or degree.
www.remjobs.co.uk
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