Packaging Process Engineer - Semiconductor

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A leading developer of sensors & detectors require a Packaging Process Engineer to carry out the hands-on packaging of devices. Hands-on experience with two or more of the following packaging processes is required: wire bonding, encapsulation, capping, die attach, epoxy attach, or hermitic sealing. Experience with Chip-On-Board, MCM, PCB substrates, ceramic substrates, or TO packaging would also be advantageous. You should have a HND or degree.

www.remjobs.co.uk

Date Posted	Tue 23 Mar 2004
Job Type	Permanent
Job Status	Full-time
Job Reference	KC466m
Location	Surrey, London, South East, England, Kent, East Su
Salary	c£30,000+
Start Date	asap
Duration	Permanent
Benefits	.
Skills	Packaging, Wire Bonding, Encapsulation, Capping, Die Attach, Epoxy Attach, Hermitic Sealing, COB, MCM, TO, Leak Testing, semiconductor
Company Name	re&m (Recruiting Engineers & Managers)
Contact Name	Karel Cromarty
Contact Telephone	01442 838 435
Contact Fax	01442 215 791
Website	www.remjobs.co.uk
Company Address	Seymour House Whiteleaf Road Hemel Hempstead Herts HP3 9DE
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