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This is a great opportunity to join an expanding organisation that is recognised as a specialist supplier of RF, microwave and sensing component and sub-systems with a strong, and in a number of cases leading, positions in global, niche markets.
Our client operates from two manufacturing sites in the UK, where they employ around 1200 people. Their sales activity is truly global - they export over 65% of what they make - with direct sales offices in the UK, United States of America, France and Germany. In addition they have an extensive network of distributors, giving them coverage in over 100 countries.
They are seeking a Manufacturing Engineer to join a team working to improve yield, throughput and efficiency. The role will include the implementation of a WIP tracking system, SPC, and capacity modelling. The successful candidate will be required to support manufacturing on a day-to-day basis along with training operations staff and ensuring that documentation / risk assessments are in place.
The ideal candidate will have a BSc in Physics/Engineering related with 2/3 years experience and knowledge of electronics/semiconductor packaging methods and materials. Hands-on experience of semiconductor / electronics packaging processes (including wire bonding, die attach and dicing) would be an advantage.
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