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<p>Here is an opportunity to become a prominent player in a new design / manufacturing project.
<p>Our clients new venture will integrate the existing team and associated skillset of an established R&D organisation. Developing and manufacturing high performance chips for leading edge applications, processes will include high speed BiCMOS, RF IC and SiGe, among others.
<p>Our client now has two opportunities for talented IC CAD engineers, who might offer anywhere from 3 to 33 years of relevant experience. The successful candidates will become involved in defining and implementing a new flow, specifically an automated high speed design GDSII data to reticle data service. Supporting multiple deep sub micron technologies, this flow will include:
<p>Physical verification, reticle frame generation, documentation and revision control, OPC/PSM data manipulation, advanced generated layer implementation for CMP tiling and dummy pattern requirements. This will require secure high speed data transfer between customer, foundry and mask shop.
<p>Specific skills required include:
<li>Proficiency in reticle layout / Data fracture, OPC, tiling
<li>Experience in 0.18um technology is preferred
<li>Expertise in CAD layout and physical verification software (Avant! Hercules, etc)
<li>In depth knowledge of deep sub micron digital/mixed-signal design flows
<li>Foundry and/or photomask experience highly desirable
<li>Programming capabilities
<li>Good English verbal and written communication skills
<p>Remuneration will include good basic salary plus incentivising stock options.
<p>If you are keen to directly influence the success of a major new technology project, please contact us immediately to discuss further.
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