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Our client, a market leader in discrete semiconductor design, packaging and testing, is currently searching for a Semiconductor Process Engineer - back end Assembly. The role will involve process engineering within the die attach and wirebond areas. Responsibility for the equipment as well as the process yields and quality will be required as well as new product development.
The successful candidates will have the following skills;
-Knowledge of wirebond/die attach processes
-Experience within a high volume assembly manufacturing environment
-Discrete IC product experience beneficial
-HND or equivalent in electronics
Please call us to discuss further.
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