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Our successfully growing client now requires an IC Packaging Engineer to design new semiconductor packages (BGAs, MCMs, WLCSPs) and to liase with subcontractors to move the designs into production. The role will include using PCB and IC design tools to design and verify new package designs. The ability to hold design reviews and project manage the new product through to final production will be required. Required skills include: -Strong IC semiconductor packaging knowledge -Experience of working within a high volume manufacturing environment -Ability to work with various departments within the company -Good project management and communication skills -Degree or equivalent qualifications Please call us to discuss further.
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