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We are currently searching for a New Package Development Director with the following key skills: IC, director manufacturing, packaging, assembly, CSP, flip chip, stacked die, semiconductor, NPI, development, leadership, silicon, engineer, reliability, wafer fab, physics, assembly, jobs.
Our global client is searching for a New Product Package Development Director to be responsible for the IC Package Platform development across the entire company including leadframe, wirebonding, MCMs and test platform development. The role will involve interacting with senior management in the development of strategic IC packaging roadmaps. Working closely with IC new product development teams will be required.
Desired qualifications are as follows;
Strong semiconductor backend process knowledge and IC package development and assembly experience
Knowledge of advanced packages required
Familiar with high volume semiconductor manufacturing environment and Far Eastern subcons
Strong knowledge of package reliability conditions
PhD, BSc Physics / Electronic Engineering or equivalent
Please contact us for additional information.
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